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Signal Integrity Issues and Printed Circuit Board Design by Douglas Brooks

Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks ebook
Publisher: Prentice Hall International
ISBN: 013141884X, 9780131418844
Format: djvu
Page: 409

Several of these issues can be . In this second issue, we have added . Power has Noise, voltage drop along traces, current density variation, and other problems occur. As a world-class semiconductor company, Fujitsu Semiconductor needed to address timing issues at three levels: LSI, PKG, and PCB, especially with the rapidly emerging DDR2/3/4 and SERDES interconnect standards. By simultaneous I/O design planning and FPGA placement by both the teams important objectives like meeting of overall timing (both FPGA in-chip and on board), meeting of PCB signal integrity constraints, less number of PCB layers and less PCB area can be achieved. The longer the trace, or the greater the frequencies involved, then the greater the need to control the trace impedance. The FPGA I/O design and placement of FPGA on PCB. Basic introduction to the manufacture of controlled impedance printed circuit boards (PCBs). This article presents a brief overview of board level simulation for high-speed, multilayer PCB design and highlights some common traps and some tips so hopefully you get it right first time. John Isaac The HyperLynx PI tool was created for designers to evaluate and mesh these power requirements, reducing the need for decoupling capacitators, shortening design times and eliminating respins, and improving signal integrity. They selected the Mentor Graphics HyperLynx technology, widely adopted at many PCB design sites, as their robust signal and power integrity solution. But using multiple FPGA implies multichip design and there are several issues which need to be taken care. In actual production environments and industry, PCB design and signal integrity issues like impedance mismatch are done and checked using software like PADS and Allegro. So although the package and your clock speed have not changed a problem may exist for legacy designs. When board traces carry signals containing high frequencies, care must be taken to design traces that match the impedance of the driver and receiver devices. Its low dielectric constant and low dissipation factor make it an ideal candidate for broadband circuit designs requiring fast signal speeds or improved signal integrity. Considerations apply to signal transfer through traces on a PCB. High density interconnect on PCB and packaging designs with signal switch rates over 5 Gpbs require model characterizations that can support frequency ranges from DC up to THz. Solution 2D Full Wave field solver (EMS2D) provides the full -frequency range analysis from DC, through the middle frequency range which covers the skin effect, to the THz range of the electromagnetic interactions which address resonances, radiations and EM signal integrity issues. This week, Mentor Graphics released HyperLynx PI, a design software program aimed at improving power integrity on the PCB.